Designed for Wide Variety of On-Wafer Applications 

• RF measurements up to 67 GHz & 4-port setup 

• Integration of broadband measurements up to 220 GHz 

• Simultaneously for RF, DC-IV / DC-CV / Pulsed-IV measurements 

• High Power applications up to 10 kV/400 A 

Production Reliability 

• Designed for 24/7 production reliability 

• Safety cover with interlocks providing a closed environment 

Ergonomic Design and Options 

• Designed with easy single wafer front loading and unloading 

• Large Probe Platen supporting up to 4x RF MicroPositioners or standard 4.5” / 6.5” probe card holder 

• Standard two cassettes for 100, or 150 or 200 mm wafers 

• Available with various ambient or thermal chucks from 20 to 300 °C 

• Wide range of on-axis optics in addition to 

• Standard off-axis wafer alignment camera 

• Optional upper looking chuck camera for probe-to-pad alignment 

• Dedicated thin wafer handling option down to 50 µm