TS3000
300 mm Automated Probe Systems
Cost-Effective System for RF, mmW and Product Engineering
310 mm x 335 mm (12.2 x 13.19 in)
0.5 µm
< 2.0 µm (0.08 mils)
< 1.0 µms
Closed-loop high precision stepper motors
Slowest: 10 μm / sec | Fastest: 50 mm / sec
Designed for Variety of On-Wafer Applications
• DC-IV / DC-CV / Pulsed-IV applications
• RF, mmW, load-pull applications & 4-port setup
• IC Design Validation, Failure Analysis in wide temperature range from 20 to 300 °C
Extended Flexibility
• Using MicroPositioners and probe cards simultaneously
• Programmable microscope movements for more automation and ease of use
• The shortest cable interface to IC tester
• Minimize the platen-to-chuck distance for mmW & probing with active probes
• Supports film-frame probing • Upgradable with IceFreeEnvironment™
Ergonomic Design and Footprint
• Easy wafer or single DUT loading from the front
• Integrated active vibration isolation
• Completely integrated prober control for faster, safer and convenient system and test operation
• The Safety Test Management (STM™) with automated dew point control
• Reduced footprint due to smart chiller space arrangement
• Instrument shelf option for shorter cables and higher measurement dynamic