PRODUCT

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TS150

150mm Manual Probe System
For accurate and reliable DC/CV, RF and High Power measurements

  • Wafer size

    6 inch

  • Total travel range

    180 x 230 mm (7.1 x 9.1inch)

  • Planarity

    < 10 µm

  • Theta travel

    360°

  • Movement

    Puck controlled air bearing stage

Universal Use

​• ​Designed for wide variety of applications such as Device Characterization and Modeling, Wafer Level Reliability, Failure Analysis, IC Engineering, MEMS and High Power

 

Ergonomic Design  

• Unique puck controlled air bearing stage for quick single-handed operation 

• Rigid platen accommodates up to 10 DC or 4 RF positioners 

• Highly repeatable platen lift design with three discrete positions for contact, separation, and loading 

 

Upgradability  

• Available with various chuck options and wide range of accessories such as DC/RF/mmW MicroPositioners, Optics, microscopes and 

EMI shielded dark box to support various application requirements