PRODUCT

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TS3500 Series

300 mm Automated Probe Systems
Cost-Effective System for RF, mmW and Product Engineering

  • Travel range

    310 mm x 530 mm (12.2 x 20.87 in)

  • Resolution

    0.5 µm

  • Accuracy

    < 2.0 µm (0.08 mils)

  • XY stage drive

    Closed-loop high precision stepper motors

  • Speed

    5-Speed XY chuck stage speed movement

  • Max. movement speed

    50 mm / sec

 Designed for Variety of On-Wafer Applications 

• DC-IV / DC-CV / Pulsed-IV applications 

• RF, mmW, load-pull applications & 4-port setup 

• IC Design Validation, Failure Analysis in wide temperature range from 20 to 300 °C

 

Extended Flexibility 

• Using MicroPositioners and probe cards simultaneously 

• Programmable microscope movements for more automation and ease of use 

• The shortest cable interface to IC tester 

• Minimize the platen-to-chuck distance for mmW & probing with active probes 

• Supports film-frame probing • Upgradable with IceFreeEnvironment™ 

 

Ergonomic Design and Footprint 

• Easy wafer or single DUT loading from the front 

• Integrated active vibration isolation 

• Completely integrated prober control for faster, safer and convenient system and test operation 

• The Safety Test Management (STM™) with automated dew point control 

• Reduced footprint due to smart chiller space arrangement 

• Instrument shelf opti

 

 WaferWallet® Option 

• Designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “modeling” wafers 

• Fully-automated tests with up to five identical wafers at multiple temperatures 

• Unique capability to load/unload wafers at any temperature