TS3500 Series
300 mm Automated Probe Systems
Cost-Effective System for RF, mmW and Product Engineering
310 mm x 530 mm (12.2 x 20.87 in)
0.5 µm
< 2.0 µm (0.08 mils)
Closed-loop high precision stepper motors
5-Speed XY chuck stage speed movement
50 mm / sec
Designed for Variety of On-Wafer Applications
• DC-IV / DC-CV / Pulsed-IV applications
• RF, mmW, load-pull applications & 4-port setup
• IC Design Validation, Failure Analysis in wide temperature range from 20 to 300 °C
Extended Flexibility
• Using MicroPositioners and probe cards simultaneously
• Programmable microscope movements for more automation and ease of use
• The shortest cable interface to IC tester
• Minimize the platen-to-chuck distance for mmW & probing with active probes
• Supports film-frame probing • Upgradable with IceFreeEnvironment™
Ergonomic Design and Footprint
• Easy wafer or single DUT loading from the front
• Integrated active vibration isolation
• Completely integrated prober control for faster, safer and convenient system and test operation
• The Safety Test Management (STM™) with automated dew point control
• Reduced footprint due to smart chiller space arrangement
• Instrument shelf opti
WaferWallet® Option
• Designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “modeling” wafers
• Fully-automated tests with up to five identical wafers at multiple temperatures
• Unique capability to load/unload wafers at any temperature