BRAND

1/11

TS2000

200 mm Automated Probe Systems
For reliable DC, RF and High Power Production Test Measurements

  • Travel range

    210 mm x 340 mm (8.3 x 13.4 in)

  • Resolution

    0.1 µm

  • Repeatability

    < 1.0 µm

  • XY stage drive

    Closed-loop high precision servo motor PID control

  • Speed

    5-Speed XY chuck stage speed movement

  • Max. movement speed

    100 mm / sec.

 Designed for wide variety of On-Wafer Production Applications

• DC-IV / DC-CV / Pulsed-IV applications

• RF applications up to 67 GHz & 4-port setup

• High Power production application up to 10 kV / 600 A

• IC Design validation from ambient to 300 °C

 

Production Reliability 

• Designed for 24/7 production reliability

• Integrated passive vibration isolation table

• Optional active vibration isolation base

• Ready for temperature ambient to 300 °C 

 

Ergonomic Design and Options 

• Designed with easy single wafer front loading

• Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder 

• Available with various chuck options and wide range of accessories such as 4.5" probe card adaptor, 

 DC/RF MicroPositioners, microscopes to support various application requirements