TS2000
200 mm Automated Probe Systems
For reliable DC, RF and High Power Production Test Measurements
210 mm x 340 mm (8.3 x 13.4 in)
0.1 µm
< 1.0 µm
Closed-loop high precision servo motor PID control
5-Speed XY chuck stage speed movement
100 mm / sec.
Designed for wide variety of On-Wafer Production Applications
• DC-IV / DC-CV / Pulsed-IV applications
• RF applications up to 67 GHz & 4-port setup
• High Power production application up to 10 kV / 600 A
• IC Design validation from ambient to 300 °C
Production Reliability
• Designed for 24/7 production reliability
• Integrated passive vibration isolation table
• Optional active vibration isolation base
• Ready for temperature ambient to 300 °C
Ergonomic Design and Options
• Designed with easy single wafer front loading
• Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder
• Available with various chuck options and wide range of accessories such as 4.5" probe card adaptor,
DC/RF MicroPositioners, microscopes to support various application requirements