BRAND
1/11
TS200
200mm Manual Probe System
For accurate and reliable DC/CV, RF and High Power measurements
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Wafer size
8 inch
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Total travel range
240 x 315mm (9.4 x 12.4 in)
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Planarity
< 10 µm
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Theta travel
360°
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Movement
Puck controlled air bearing stage
Universal Use
• Designed for wide variety of applications such as RF and mmW, Device Characterization, Wafer Level Reliability, High Power, Failure Analysis, IC Engineering and MEMS
Ergonomic Design
• Unique puck controlled air bearing stage for quick single-handed operation
• Rigid platen accommodates up to 10 DC or 4 RF positioners
• Highly repeatable platen lift design with three discrete positions for contact, separation, and loading
Upgradability
• Available with various chuck options and wide range of accessories such as DC/RF/mmW MicroPositioners, Optics, microscopes and
EMI shielded dark box to support various application requirements
