BRAND

1/11

TS300

300 mm Manual Probe System
For accurate and reliable DC/CV and RF measurements

  • Wafer size

    12 inch

  • Total travel range

    330 x 395 mm (13.0 x 15.6 in)

  • Planarity

    < 10 µm

  • Theta travel

    360°

  • Movement

    Puck controlled air bearing stage

Universal Use

​• ​Designed for wide variety of applications such as Device Characterization and Mode ling, Wafer Level Reliability, Failure Analysis, IC Engineering and MEMS

 

Ergonomic Design  

• Unique puck controlled air bearing stage for quick single-handed operation

• Rigid platen accommodates up to 10 DC or 4 RF positioners 

• Highly repeatable platen lift design with three discrete positions for contact, separation, and loading

 

Upgradability  

• Available with various chuck options and wide range of accessories such as DC/RF/mmW MicroPositioners, Optics, microscopes and 

EMI shielded dark box to support various application requirements